Enabling Next Generation CMOS by Novel EOT Scaling Module
Year: 2021
Type: conference-paper
Source: Symposium on VLSI Technology
Authors: Liyuan Dong, Shih‐Ya Hung, M. J. Bevan, P. Jamison, J. Zhang, Hualan Zhou, B. Colombeau, Reagan Curtis, J. Devrajan, R. Bao, Rhett T. George, M. Kim, K. Karandikar, M. Stolfi, N. Loubet, J. Swenberg, T. Guarini, L. Wang, Yu Yan, V. Banthia, Satheesh Kuppurao, Bala Haran, S. Natarajan
Institutions: Applied Materials (United States), IBM (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W3194856186