Work

Analysis of copper/fluoropolymer film systems for multilevel interconnects

Year: 1998

Type: dissertation

Abstract: Characteristics of film materials considered for multilevel interconnects -- Structure and dielectric properties of fluoropolymer films -- Properties of copper films -- Adhesion of metals to fluoropolymers -- Experimental methodology -- Fabrication of fluoropolymer films -- Fabrication of copper films -- Characterization of film materials -- Dielectric properties of fluoropolymer films -- Adhesion of copper to fluoropolymers.

Source: PolyPublie (École Polytechnique de Montréal)

Author: Avni Alptekin

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: green

OpenAlex ID: W3195954465

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