Modified solution of an interface rigid line between two bonded half-planes under remote in-plane heat flux
Work
Year: 2021
Type: article
Source: Acta Mechanica
Authors Guang Yang, Pengyu Pei, Cheng Huang, Ming Dai
Institutions Nanjing University of Aeronautics and Astronautics, Jinling Institute of Technology, Changzhou Institute of Technology
Cites: 13
Cited by: 1
Related to: 10
FWCI: 0.137
Citation percentile (by year/subfield): 32.82
Subfield: Mechanics of Materials
Field: Engineering
Domain: Physical Sciences
Sustainable Development Goal Affordable and clean energy
Open Access status: closed
Funders National Natural Science Foundation of China, National Natural Science Foundation of China, Natural Science Research of Jiangsu Higher Education Institutions of China, Natural Science Research of Jiangsu Higher Education Institutions of China
Grant IDS 11802040, 52075232, 19KJA150007, 18KJB130001