Work

Effect of transient current bonding on interfacial reaction in Ag-coated graphene Sn–Ag–Cu composite solder joints

Year: 2021

Type: article

Abstract: To address the problem of floating and aggregation of Ag–GNSs in the molten pool during the traditional reflow soldering process, Cu/SAC/Ag–GNSs/Cu sandwich joints were prepared under an applied current density (1.0×104 A/cm2) for a few hundred milliseconds to produce Ag-coated graphene-reinforced Sn–Ag–Cu (SAC/Ag– GNSs) solder joints. The experimental results showed that Ag–GNSs were homogenously dispersed in the solder joints, providing more Cu6Sn5 grain nucleation sites, which refined these grains and reduced the thickness difference at the anode and cathode. In addition, the Cu6Sn5 morphology changed from rod-like to plate-shaped because of the uniform distribution of Ag–GNSs and constitutional supercooling. The significantly increased shear strength of the transient current bonding and the change in the fracture mechanism were due to the uniformly distributed Ag–GNSs and the microstructural changes.

Source: Transactions of Nonferrous Metals Society of China

DOI: 10.1016/s1003-6326(21)65666-2

Authors: Yong-dian HAN, Jia-hang YANG, Lian-yong XU, Hong-yang JING, Lei ZHAO

Institution: Tianjin University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: diamond

Funder: National Natural Science Foundation of China

Award: G3292918712