Work

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Year: 2021

Type: book

Source: CRC Press eBooks

DOI: 10.1201/9781003247005

Authors: Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich

Language: English

Topic: Spacecraft Design and Technology

Subfield: Aerospace Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3211722622

FWCI: 1.121

Cites:

Cited by: 5

Related to: 10