Effect of rolling temperature on interface and bond strength development of roll bonded copper/aluminium metal laminates
Year: 1999
Type: article
Source: Journal of Materials Science
Authors: X. K. Peng, G. Heness, W. Y. Yeung
Institution: University of Technology Sydney
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W332045266
