Work

Infusion Processing for Reliable Copper Interconnects

Year: 2007

Type: conference-paper

Source: SIAM International Conference on Data Mining

Authors: Satoshi Kondo, Takashi Ishigami, Mitsuo Enomoto, Toshiaki Suzuki, Scott E. Sherman, M. D. Tabat, J. Hautala

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W404647468

FWCI:

Cites:

Cited by: 1

Related to: 20