Work

Fundamentals of Microsystems Packaging

Year: 2001

Type: article

Author: Rao Tummala

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W418442035

FWCI: 46.08

Cites:

Cited by: 826

Related to: 10