2.5D/3D System‐in‐Packaging Integration
Year: 2021
Type: other
Authors: King-Ning Tu, Chih Chen, Hung-Ming Chen
Institution: National Yang Ming Chiao Tung University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4200290232