Damage and residual layer analysis of reactive ion etching textured multi-crystalline silicon wafer for application to solar cells
Year: 2022
Type: article
Source: Solar Energy
Authors: Dongkyun Kang, HyunJung Park, Dongjin Choi, Hyebin Han, Jaeseung Seol, Yoonmook Kang, Hae-Seok Lee, Donghwan Kim
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G3637962436, G6479017549
OpenAlex ID: W4205605066
