Work

Effect of critical properties of epoxy molding compound on warpage prediction: A critical review

Year: 2022

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2022.114480

Authors: Sukrut Prashant Phansalkar, Changsu Kim, Bongtae Han

Institution: University of Maryland, College Park

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4210275616

FWCI: 2.877

Cites: 89

Cited by: 61

Related to: 10