Work

Reliability Characterization for Advanced DRAM using HK/MG + EUV Process Technology

Year: 2021

Type: conference-paper

Source: Technical digest - International Electron Devices Meeting/Technical digest

DOI: 10.1109/iedm19574.2021.9720613

Authors: S. Lee, G.-J. Kim, N-H. Lee, KW. Lee, BW. Woo, J. Jin, JG. Kim, YS. Lee, HS. Kim, S. Pae

Institutions: Samsung (South Korea), Samsung Electronics (South Korea)

Language: English

Topic: Semiconductor materials and devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4226094037

FWCI: 6.577

Cites: 3

Cited by: 22

Related to: 10