Work

Use of the In-Process Bond Shear Test for Predicting Gold Wire Bond Failure Modes in Plastic Packages

Year: 1991

Type: conference-paper

Source: IEEE International Reliability Physics Symposium proceedings

DOI: 10.1109/irps.1991.363209

Authors: Michael Mahaney, Melissa Shell, Richard Strode

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4229940448

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Cited by: 2

Related to: 10