The Effects of Composition and Design of Experiment on the Quality of Al-Ge Eutectic Bonding for Wafer Level Packaging
Year: 2012
Type: conference-abstract
Source: ECS Meeting Abstracts
Authors: Xin-Hua Huang, Chun-Wen Cheng, Ping-Yin Liu, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, David Huang, Cindy Colinge
Institution: Taiwan Semiconductor Manufacturing Company (Taiwan)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W4238744837