Work

Kinetically-Limited Electrodeposition of Copper on Gold in the Presence of Additives: Multiscale Phenomena during Nucleation and Overgrowth on a Resistive Strip

Year: 2008

Type: conference-abstract

Source: ECS Meeting Abstracts

DOI: 10.1149/ma2008-01/25/879

Authors: Mohan Karulkar, Matthew Willis, Richard Braatz, Richard C. Alkire

Institutions: University of Illinois Urbana-Champaign, University of Illinois System

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4244002032

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