Work

Studying the effects of chemistry and geometry on DSA hole-shrink process in three dimensions

Year: 2018

Type: conference-paper

Source: SPIE Novel Patterning Technologies

DOI: 10.1117/12.2297461

Authors: Chun Zhou, Roel Gronheid, Paulina Rincon-Delgadillo, Juan de Pablo, Paul F. Nealey, Tsuyoshi Kurosawa, Jiaxing Ren, Cody Bezik, Jan Doise, Tamar Segal-Peretz, Takahiro Dazai, Akiyoshi Yamazaki

Institutions: University of Chicago, IMEC, Tokyo Ohka Kogyo (Japan), Technion – Israel Institute of Technology

Language: English

Topic: Block Copolymer Self-Assembly

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4255785525

FWCI: 1.132

Cites: 21

Cited by: 2

Related to: 10