Work

Numerical Simulation of Superfilling during Copper Electrodeposition in Small Trenches

Year: 2007

Type: conference-abstract

Source: ECS Meeting Abstracts

DOI: 10.1149/ma2007-01/18/837

Authors: Xiaohai Li, Richard Braatz, R. Alkire

Institutions: University of Illinois Urbana-Champaign, University of Illinois System

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: bronze

Funders: National Science Foundation, National Centre for Supercomputing Applications

Award: Additive Mediated Nucleation and Growth during Electrodeposition: High-throughput Experiments and Multiscale Simulation

OpenAlex ID: W4255961356

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