Year: 2022
Type: preprint
Abstract: The chiplet-based System-in-Package~(SiP) technology enables more design flexibility via various inter-chiplet connection and heterogeneous integration. However, it is not known how to convert such flexibility into cost efficiency, which is critical when making a design decision. In this paper, we develop an analytical cost model that can estimate the cost of the 2.5D chiplet-based SiP systems under various interconnection options and technology nodes. We conducted two case studies using our cost model to explore the cost characteristics of the 2.5D chiplet-based SiP system. Based on the case studies, we made several observations on the interposer selection, design partition granularity, and technology node adoption for cost-efficient chiplet-based SiP design.
Source: arXiv (Cornell University)
Authors: Tang, Tianqi, Xie, Yuan
Institution: University of California, Santa Barbara
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W4283017957