Work

Preparation and performance of an investigated temperature response device based on Sn–3.5 Ag film

Year: 2022

Type: article

Source: Journal of Materials Science Materials in Electronics

DOI: 10.1007/s10854-022-08652-5

Authors: Tao Qiu, Jinchun Deng, Chao He, Jun Shen

Institution: Chongqing University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4285085456

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Cites: 41

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Related to: 10