Work

Film Property Analysis by FTIR on ULK Film Deposition and UV Curing Process

Year: 2022

Type: conference-paper

Source: China Semiconductor Technology International Conference (CSTIC)

DOI: 10.1109/cstic55103.2022.9856724

Authors: Xinchen Cai, Tianjiao Teng, Xuanyu Lin, Peipei Li, Xinyi Chen, Zhuo Wang, Huaqiang Tan, Qing Mi, Bo Zhang, Jintao Liu

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4292829393

FWCI:

Cites: 6

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Related to: 10