Work

High Speed X-ray Tomography with Submicron Resolution for FA and Reverse Engineering of Packages, PCBs, and 300 mm Wafers

Year: 2022

Type: article

Source: EDFA Technical Articles

DOI: 10.31399/asm.edfa.2022-3.p032

Authors: S.H. Lau, Sheraz Gul, Jeff Gelb, Tianzhu Qin, Guibin Zan, Katie Matusik, David Vine, Sylvia Lewis, Wenbing Yun

Institutions: Sigray (United States), Stanford University

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4295358237

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