Work

Passive Intermodulation Under Different Spring Contact Conditions

Year: 2022

Type: conference-paper

Source: IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)

DOI: 10.1109/emcsi39492.2022.9889661

Authors: Shengxuan Xia, Emmanuel Olugbade, Yuchu He, Yansheng Wang, Hanfeng Wang, Krishna Rao, Marco Poort, Haicheng Zhou, Warren Lee, Nicholas McDonnell, Jonghyun Park, Chulsoon Hwang

Institutions: Missouri University of Science and Technology, Google (United States)

Language: English

Topic: Electrical Contact Performance and Analysis

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Science Foundation

Award: Phase III IUCRC at Missouri University of Science and Technology: Center for Electromagnetic Compatibility

OpenAlex ID: W4297097618

FWCI: 2.537

Cites:

Cited by: 3

Related to: 10