Work

Preparation and performance evaluation of Sn-Bi solder paste

Year: 2022

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept56209.2022.9873299

Authors: Yunhui Zhu, Lifang Wang, Xudong Wang, Siliang He, Jiaqiang Huang

Institution: Guilin University of Electronic Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Natural Science Foundation of Guangxi Province

OpenAlex ID: W4297786187

FWCI: 0.421

Cites: 10

Cited by: 1

Related to: 10