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Thermal conduction in novel isotropic conductive adhesive

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Year: 2017
Type: conference-paper
Source: International Workshop on Thermal Investigations of ICs and Systems
DOI: 10.1109/therminic.2017.8233820
Authors: Helge Kristiansen, Keith Redford, Susanne Helland, Erik Kalland, Nina H. Hoglund, Mohammad Abo Ras, Corinna Grosse, Bruno Hay, Liana Ramiandrisoa, Guillaume Davee, Severine Gomes, Sigurd R. Pettersen
Institutions: Norwegian University of Science and Technology, Mosaic Solutions (Norway), Berliner Nanotest und Design, Laboratoire National de Métrologie et d'Essais, Centre National de la Recherche Scientifique
Language: English

Topic: Thermal properties of materials
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences

Open Access status: closed

Funders: European Commission, Norges Forskningsråd, FP7 Nanosciences, Nanotechnologies, Materials and new Production Technologies
OpenAlex ID: W2777702321
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Cites: 18
Cited by:
Related to: 10
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