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Thermal conduction in novel isotropic conductive adhesive
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Year:
2017
Type:
conference-paper
Source:
International Workshop on Thermal Investigations of ICs and Systems
DOI:
10.1109/therminic.2017.8233820
Authors:
Helge Kristiansen,
Keith Redford,
Susanne Helland,
Erik Kalland,
Nina H. Hoglund,
Mohammad Abo Ras,
Corinna Grosse,
Bruno Hay,
Liana Ramiandrisoa,
Guillaume Davee,
Severine Gomes,
Sigurd R. Pettersen
show all 12
Institutions:
Norwegian University of Science and Technology,
Mosaic Solutions (Norway),
Berliner Nanotest und Design,
Laboratoire National de Métrologie et d'Essais,
Centre National de la Recherche Scientifique
Language:
English
Topic:
Thermal properties of materials
Subfield:
Materials Chemistry
Field:
Materials Science
Domain:
Physical Sciences
Open Access status:
closed
Funders:
European Commission,
Norges Forskningsråd,
FP7 Nanosciences, Nanotechnologies, Materials and new Production Technologies
OpenAlex ID:
W2777702321
FWCI:
Cites:
18
Cited by:
Related to:
10