Work

An Embedded GaN Power Module with Double-Sided Cooling and High-Density Integration

Year: 2022

Type: conference-paper

Source: IEEE Energy Conversion Congress and Exposition (ECCE)

DOI: 10.1109/ecce50734.2022.9947786

Authors: Xingyue Tian, Niu Jia, Dennis Boris Chertkovsky, Jingjing Sun, Hua Bai, Leon M. Tolbert, Han Cui

Institution: University of Tennessee at Knoxville

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

Funder: U.S. Department of Energy

Award: G572495442

OpenAlex ID: W4310502163

FWCI: 6.276

Cites: 12

Cited by: 16

Related to: 10