Experimental and multiphysics simulation study of atoms migration and morphology evolution in solder joints under high current density
Year: 2022
Type: article
Authors: Fei Jia, Leyi Niu, Yuchen Xi, Yuanying Qiu, Hongbo Ma, Chengpeng Yang
Institutions: Xidian University, Northwestern Polytechnical University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4311430903