Work

Revisiting 3D-X-ray for Rapid Reverse Engineering in Large Electronic Packages and PCBs

Year: 2022

Type: conference-paper

Source: IEEE Physical Assurance and Inspection of Electronics (PAINE)

DOI: 10.1109/paine56030.2022.10014959

Authors: John True, Wenbing Yun, Jeff Gelb, Sheraz Gul, David Vine, Sylvia Lewis, Daniel Johnson, S.H. Lau

Institutions: University of Florida, Sigray (United States)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4317461478

FWCI: 0.842

Cites: 9

Cited by: 4

Related to: 10