Work

Effect of Pd-P Layer on the Bonding Strength of Bi-Te Thermoelectric Elements

Year: 2019

Type: article

Abstract: In this study, the effect of electroless Pd-P plating on the bonding strength of the Bi-Te thermoelectric elements was investigated. The bonding strength was approximately doubled by electroless Pd-P plating. Brittle Sn-Te intermetallic compounds were formed on the bonding interface of the thermoelectric elements without electroless Pd-P plating, and the fracture of the bond originated from these intermetallic compounds. A Pd-Sn solder reaction layer with a thickness of approximately 20 µm was formed under the Pd-P plating layer in the case of the electroless Pd-P plating, and prevented the diffusion of Bi and Te. In addition, the fracture did not occur on the bonding interface but in the thermoelectric elements for the electroless Pd-P plating because the bonding strength of the Pd-Sn reaction layer was higher than the shear strength of the thermoelectric elements.

Source: Archives of Metallurgy and Materials

DOI: 10.24425/amm.2019.129481

Authors: Sung Hwa Bae, Se Hun Han, Injoon Son, Kyung Tae Kim

Institutions: Kyungpook National University, Korea Institute of Materials Science

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: diamond

Funders: National Research Foundation, National Research Foundation of Korea, Ministry of Education, India

OpenAlex ID: W4366006137