Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Power Module Packaging
Work
Year: 2023
Type: article
Institutions Karlsruhe Institute of Technology, National Taiwan University, Resonac (Japan), DIC (Japan)
Cites: 4
Cited by: 1
Related to: 10
FWCI: 1.109
Citation percentile (by year/subfield): 61.79
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Sustainable Development Goal Affordable and clean energy
Open Access status: closed