Year: 2023
Type: preprint
Abstract: We present the required techniques for the successful low loss packaging of integrated photonic devices capable of operating down to 970 mK utilizing photonic wire bonds. This scalable technique is shown to have an insertion loss of less than 2 dB per connection between a SMF-28 single mode fibre and a silicon photonic chip at these temperatures. This technique has shown robustness to thermal cycling and is ultra-high vacuum compatible without the need for any active alignment.
Source: arXiv (Cornell University)
Institution: University of British Columbia
Language: English
Topic: Photonic and Optical Devices
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W4384616480