Work

Comprehensive 300 mm process for Silicon spin qubits with modular integration

Year: 2023

Type: conference-paper

Source: IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

DOI: 10.23919/vlsitechnologyandcir57934.2023.10185272

Authors: A. Elsayed, C. Godfrin, N.I. Dumoulin Stuyck, M.M.K. Shehata, S. Kubicek, S. Massar, Y. Canvel, J. Jussot, A. Hikavyy, R. Loo, G. Simion, M. Mongillo, D. Wan, B. Govoreanu, R. Li, I.P. Radu, P. Van Dorpe, K. De Greve

Institutions: IMEC, KU Leuven

Language: English

Topic: Quantum and electron transport phenomena

Subfield: Atomic and Molecular Physics, and Optics

Field: Physics and Astronomy

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4385192352

FWCI: 11.32

Cites: 2

Cited by: 7

Related to: 10