Work

High-strength joining of silica glass and 2024 aluminum alloy by ultrasonic-assisted soldering with Sn-Bi low temperature solder

Year: 2023

Type: article

Source: Journal of Manufacturing Processes

DOI: 10.1016/j.jmapro.2023.07.010

Authors: Xiaolei Gao, Chao Chen

Institution: Central South University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4385540615

FWCI: 2.158

Cites: 41

Cited by: 29

Related to: 10