Work

Unleashing the Power of 2D MoS2: In Situ TEM Study of Its Potential as Diffusion Barriers in Ru Interconnects

Year: 2023

Type: article

Source: ACS Applied Materials & Interfaces

DOI: 10.1021/acsami.3c10656

Authors: Ping-Hsuan Feng, Kai-Yuan Hsiao, Dun-Jie Jhan, Yu-Lin Chen, Pei Yuin Keng, Shou-Yi Chang, Ming-Yen Lu

Institution: National Tsing Hua University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funders: Taiwan Semiconductor Manufacturing Company, National Science and Technology Council

Awards: G2623073944, G410156639

OpenAlex ID: W4387331482

FWCI: 0.424

Cites: 34

Cited by: 7

Related to: 10