Analysis model for thermal resistance of double-sided cooling power module with pin–fin heat sink used in xEVs
Year: 2023
Type: article
Source: Journal of Power Electronics
Authors: Seongmoo Cho, Sang Won Yoon
Institutions: Hanyang University, Seoul National University
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G1299059172, G3400234590
OpenAlex ID: W4387672784