Work

Fingertip Plethysmography Using A Sensitive Wafer-Level-Packaged Capacitive MEMS Strain Sensor

Year: 2024

Type: conference-paper

Source: IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

DOI: 10.1109/mems58180.2024.10439370

Authors: Xinyu Jiang, Arash Shokouhmand, Negar Ebadi, Farrokh Ayazi

Institutions: Georgia Institute of Technology, Stevens Institute of Technology

Language: English

Topic: Non-Invasive Vital Sign Monitoring

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Good health and well-being

Open Access status: closed

OpenAlex ID: W4392025155

FWCI: 1.869

Cites: 10

Cited by: 2

Related to: 10