Work

Research progress of hybrid bonding technology for three-dimensional integration

Year: 2024

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2024.115372

Authors: Anqi Zhou, Yu Zhang, Fei Ding, Ziqi Lian, Renxi Jin, Yudong Yang, Qidong Wang, Liqiang Cao

Institutions: Chinese Academy of Sciences, Institute of Microelectronics, University of Chinese Academy of Sciences

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4393124995

FWCI: 5.546

Cites: 61

Cited by: 56

Related to: 10