Work

Thermal analysis, dielectric properties and conduction mechanism of Cu 1.09 Ni 0.91 (HSeO 3 ) 2 Cl 2 · 4H 2 O compound

Year: 2015

Type: conference-paper

Source: HAL

Authors: Hentek, I., Kabadou, A., Zehani, K., Bessais, Lotfi, Ben Salah, A., Loukil, M.

Institutions: University of Sfax, Institut de Recherche sur les Céramiques, Institut de Chimie et des Matériaux Paris-Est, Centre National de la Recherche Scientifique, Université Paris-Est Créteil, Institut Pasteur de Tunis

Language: English

Topic: Solid-state spectroscopy and crystallography

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4393289199

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