Work

Hybrid Bonding Technology: Chemical Mechanical Planarization Process Optimization Using Comprehensive 3D Modeling

Year: 2024

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51529.2024.00302

Authors: L. Jiang, E. M. Bazizi, G. Costrini, P. Lianto, G. See, D. Tsamados, Y. Saad, S. Dag, G. Mehta, Y. C. Yang, A. Sundarrajan, S. Kengeri

Institutions: Applied Materials (United States), Applied Materials (Singapore), Synopsys (Switzerland)

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4400033973

FWCI: 4.709

Cites: 5

Cited by: 5

Related to: 10