Work

Electromigration in Eutectic Tin-Bismuth Bottom-Terminated-Component Solder Joints

Year: 2024

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51529.2024.00233

Authors: P. Singh, L. Palmer, T. Wassick, R. F. Aspandiar, B. Franco, H. Fu, V. Vasudevan, A. Allen, K. Howell, K. Murayama, H. Zhang, A. Lifton, T. Munson, S. Middleton, R. Coyle, S. Murali

Institutions: IBM (United States), Intel (United States), DELL (United States), Hewlett-Packard (United States), NIHON SUPERIOR CO., LTD. (Japan), Shinko Electric Industries (Japan), Indium Corporation (United States), Foresite (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4400034379

FWCI: 3.034

Cites: 9

Cited by: 4

Related to: 10