Work

World’s First UCIe Interoperability Silicon Enabling Open Standards Heterogeneous Integration

Year: 2024

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51529.2024.00050

Authors: Xavier F. Brun, Stephen Wong, Manuel Mota, Edidiong Udofia

Institution: Intel (United States)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4400034651

FWCI: 4.596

Cites: 4

Cited by: 6

Related to: 10