Work

Microfluidic Lab-on-CMOS Packaging Using Wafer-Level Molding and 3D-Printed Interconnects

Year: 2024

Type: article

Source: IEEE Transactions on Biomedical Circuits and Systems

DOI: 10.1109/tbcas.2024.3419804

Authors: Jacob Dawes, Tzu-Hsuan Chou, Boyu Shen, Matthew L. Johnston

Institution: Oregon State University

Language: English

Topic: Microfluidic and Capillary Electrophoresis Applications

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Hewlett-Packard Development Company

OpenAlex ID: W4400078649

FWCI: 1.156

Cites: 35

Cited by: 11

Related to: 10