OpenAlex | Electrohydrodynamic printing of high aspect ratio conductive structures

Electrohydrodynamic printing of high aspect ratio conductive structures

Work

Year: 2024

Type: article

Source: 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

Authors Robin Kaufhold, Sherjeel M. Khan, Jürgen Kosel, Jasmin Aghassi‐Hagmann

Institutions Silicon Austria Labs (Austria), Karlsruhe Institute of Technology

Cites: 31

Cited by:

Related to: 10

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Citation percentile (by year/subfield):

Topic: Electrohydrodynamics and Fluid Dynamics

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Sustainable Development Goal Affordable and clean energy

Open Access status: closed

Funder Silicon Austria Labs