Indium-Based Flip-Chip Interconnection by Electroplating Method for Superconducting Quantum 3D Integration Architecture
Year: 2024
Type: article
Source: IEEE Electron Device Letters
Authors: Jiexun Yu, Qian Wang, Haihua Wu, Yao Zheng, Junpeng Fang, Changming Song, Yongbo Wu, Tiefu Li, Jian Cai
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: 高可靠Chiplet关键技术研究, G5597737954
OpenAlex ID: W4401507792