Work

A DC-43.5 GHz Wire-Bonding and Vertical Via Interconnection by Embedded Nonuniform Elliptical Technique for 3-D System in Package

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3442828

Authors: Pei Ge, Hao-Ran Zhu, Jia-Guo Lu

Institution: Anhui University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Anhui Province, Anhui Provincial Key Research and Development Plan

Awards: G5617017354, G5808393577, G7560810101

OpenAlex ID: W4401537472

FWCI: 0.208

Cites: 21

Cited by: 2

Related to: 10