Laser wafer dicing process optimization using the Taguchi approach
Year: 2024
Type: article
Source: Journal of Laser Applications
DOI: 10.2351/7.0001409
Authors: Chih-Fu Yang, Chih-Tsung Chang, Rui-Teng Wang, Jin-Yih Kao, Chun-Yao Hsu
Institution: Lunghwa University of Science and Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4401548798
