Work

Temperature Evaluation and Failure Analysis of Wire-Bonded FRD Chips in Surge Conditions

Year: 2024

Type: article

Source: IEEE Transactions on Power Electronics

DOI: 10.1109/tpel.2024.3444951

Authors: Feilin Zheng, Xiang Cui, Xuebao Li, Zhibin Zhao, Lei Qi

Institutions: North China Electric Power University, State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G8853640814

OpenAlex ID: W4401634128

FWCI: 0.616

Cites: 21

Cited by: 6

Related to: 10