Research on the application of boiling heat transfer in microchannels of high power electronic chips
Year: 2024
Type: conference-paper
Abstract: For electronic devices with single chip heat consumption exceeding 600 W and heat flux density exceeding 50 W/cm2, the heat dissipation requirement of a single cabinet exceeding 50 kW provides a new solution for high heat consumption and high heat flux chip heat dissipation by combining boiling heat transfer with microchannels. The flow and heat transfer differences between microchannel and conventional channel evaporators were verified through experiments. The results show that compared with conventional channels, the heat dissipation temperature difference of microchannels is reduced by 44%. The slender structure of microchannel evaporators can achieve better heat transfer performance, and the flow boiling heat transfer coefficient can reach 2-3 W/cm2·K.
Authors: Yalong Wang, Yun Zhang, Dongliang Zhou, Tao Liu, Fan Liu, Cheng Tao, Xingang Yu, Jianyin Miao
Institutions: Institute of Spacecraft System Engineering, ZTE (China)
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W4401739214