Work

Electrical Conduction Mechanism Analysis of Epoxy Resin/Microcapsule Self-Healing Composites Based on Experiment and Random Distribution Model

Year: 2024

Type: article

Source: IEEE Transactions on Dielectrics and Electrical Insulation

DOI: 10.1109/tdei.2024.3447625

Authors: Keda Chen, Jingrui Wang, Chengyi Qin, Jian Wang, Jikui Liu, Shumin Zhang, Liang Zou, Li Zhang

Institutions: North China Electric Power University, State Grid Corporation of China (China), Beijing Institute of Control Engineering, Shandong University

Language: English

Topic: Polymer composites and self-healing

Subfield: Polymers and Plastics

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, Central University Basic Scientific Research Business Expenses Special Funds, Key Technology Research and Development Program of Shandong, Guangxi Key Research and Development Program

Awards: G1238588429, G1682517100, G4301476704, G7353837725

OpenAlex ID: W4401746869

FWCI: 0.21

Cites: 19

Cited by: 2

Related to: 10