Work

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

Year: 2024

Type: article

Source: Journal of Electronic Packaging

DOI: 10.1115/1.4066320

Authors: Hisham Abusalma, Hayden Richards, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Jian Yu

Institutions: University of Maryland, College Park, DEVCOM Army Research Laboratory, United States Army Combat Capabilities Development Command

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Army Research Laboratory

Award: G1345721706

OpenAlex ID: W4401805134

FWCI: 0.411

Cites: 25

Cited by: 4

Related to: 10