Work

3-D-Conformable Conductive Composite Film for Printed Circuit Board Level Electromagnetic Interference Shielding

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3451730

Authors: Dingkun Tian, Fukang Deng, Yong Wang, Yadong Xu, Zhiqiang Lin, Mujiu Chen, Guoping Zhang, Yougen Hu, Rong Sun

Institutions: Chinese Academy of Sciences, Shenzhen Institutes of Advanced Technology, Shenzhen Institute of Advanced Electronic Materials

Language: English

Topic: Electromagnetic wave absorption materials

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Awards: G3282894754, G3949669737, G46643244

OpenAlex ID: W4401990847

FWCI: 0.541

Cites: 53

Cited by: 7

Related to: 10